High-Adhesion PI Film Stripping Equipment
As circuit line widths of advanced substrates continue to become finer and embedded passive components (such as capacitors and resistors) are increasingly integrated into substrate designs, high-adhesion PI films are applied to the substrate surface as a protective layer to prevent damage to embedded components during processing.
After completion of the manufacturing process, this protective film must be removed. Conventional manual stripping methods are inefficient and carry a high risk of substrate damage.
This equipment is a dedicated automatic stripping system for high-adhesion PI and PET films, featuring a fully automated operating design that significantly reduces manual handling while improving production efficiency and yield.