Horizontal Wet Process Equipment for Advanced Substrates

Design Concept

In response to the rapidly increasing technological demands of 5G communications and AI high-performance computing, Eclat Forever Machinery has in recent years actively invested in the development of wet process equipment for key advanced processes, including high-end substrates (such as mSAP and SAP), FC-BGA, and Wafer-Level Packaging (WLP), while simultaneously strengthening automation and intelligent monitoring functions.

To address the stringent requirements of precision etching, developing, stripping, and particle control in FC-BGA processes, Eclat Forever Machinery has introduced modular equipment designs and enclosed material handling systems, significantly enhancing process stability and cleanliness.

At the same time, to meet the fine line width / line spacing requirements driven by high-frequency and high-speed signal transmission, the company’s wet process equipment features highly clean structural designs, combined with enclosed transport systems and filtration circulation systems. These designs effectively suppress the generation and retention of particles during processing, helping customers maintain stable process cleanliness, further reduce defect rates, and enhance product reliability.

Currently, Eclat Forever Machinery has established cooperative relationships with multiple leading manufacturers in the high-end substrate and advanced packaging sectors both domestically and internationally. A variety of Eclat Forever Machinery’s wet process equipment has been successfully implemented in pilot production and mass production processes, receiving strong recognition from customers.

Looking ahead, the company will continue to enhance equipment performance and intelligent system integration, striving to become a key technology partner for next-generation advanced packaging process equipment.

Equipment Specifications

Substrate Size	510 (W) × 510 (L) mm (customizable upon request)
Substrate Thickness	0.2 – 3.0 mm or 0.8 – 3.6 mm
Production Speed	0.5 – 2 m/min (customizable upon request)
Roller Configuration	3-point support / 2-point assist or 4-point assist (depending on substrate thickness)
Cleanliness	Cleanliness performance is dependent on environmental conditions; Class 100 (drying section only)
Applicable Substrates	ABF substrates, Glass