Horizontal Wet Process Equipment for Advanced Substrates

Design Concept

With the rapid advancement of 5G, AI, and high-performance computing (HPC) applications, ABF substrates and TGV (Through Glass Via) processes are evolving toward multi-layer structures, higher density, and thinner profiles, placing unprecedented demands on substrate handling stability and process cleanliness.
When processing ultra-thin substrates below 0.1 mm, conventional top-and-bottom clamping equipment often encounters issues such as gravity-induced deformation, pressure-related breakage, and particle contamination, making it difficult to meet the high-yield requirements of advanced manufacturing processes.

To address these challenges, Eclat Forever Machinery has redefined conventional equipment design and developed a Vertical Front-and-Rear Clamping Frame Wet Process System, specifically engineered for next-generation ultra-thin substrates.
This system integrates multiple proprietary patented technologies and offers the following key advantages:

The equipment has been successfully introduced to several advanced packaging and high-end substrate manufacturers for pilot production validation and has received strong customer recognition.
Eclat Forever Machinery will continue to leverage its equipment integration expertise and deep process understanding to help customers overcome future advanced packaging technology barriers.

Equipment Design Features

• Class 100 Ultra-High Cleanliness Level
  Strict control of the process environment effectively prevents secondary contamination, enhancing product yield and process reliability.
• Patented Frame Design with Anti-Collision Protection System
  Exclusive structural designs significantly extend frame service life and prevent mechanical interference or misalignment risks during high-speed operation.
• Dual-Sided Spray Pressure and Air-Drying Technology
  Ensures consistency and uniformity in double-sided substrate processing, eliminating chemical cross-contamination and residual liquid on frames.
• Non-Contact Conveyance System
  Designed for fine-line, high-end substrates to prevent mechanical contact and damage during transportation.

Equipment Application Value

• Reduced Maintenance Frequency and Shortened Service Cycles
  High-stability design minimizes equipment abnormalities and downtime, improving overall equipment utilization.
• Improved Product Yield and Reduced Scrap Rate
  Clean processing and precise control ensure stable manufacturing performance, enhancing competitiveness in advanced processes.
• High-Safety Design
  Ergonomics-oriented mechanical design reduces operational risks and ensures operator safety.

Equipment Specifications

Equipment Dimensions	2500 (W) × 2100 (H) mm (varies by process length)
Processing Size	510 x 510 mm + 510 x 515 mm
Processing Thickness	0.03~3mm
Cleanliness Level	CLASS 100
Throughput	2~3sheets / min
Frame Quantity Requirement	Customizable based on process requirements
OPTION	① Cart system ② Frame torque detection function